Recent developments in THz devices, photonic generation techniques, and wideband circuits have enabled short range links exceeding 100 Gb/s and high resolution sensing capabilities. Although THz frequencies may play a limited role in wide area mobile networks, their importance in semiconductor centric architectures is growing.
Heterogeneous integration, silicon photonics, and co packaged optics (CPO) provide new pathways for THz band interconnects, THz over fiber systems, and high resolution sensing for materials, devices, and integrated systems. These directions highlight THz as a versatile technology that integrates communication, sensing, and photonics within next generation semiconductor platforms.
This presentation will review recent achievements and discuss emerging THz applications for integrated systems in the 2030s.